90 to 450 ºC / 190 to 840 ºF
Dynamic Soldering Profiles
Designed to avoid thermal shock when soldering Ceramic Chip components like MLCC, this new and unique feature allows controlling the heating ramp up rate of the tool to gradually increase the temperature of the
component through all the phases of the soldering process. Up to 25 fully configurable soldering profiles can be stored.
These modes lower soldering tip temperature when the tool rests in the stand in order to avoid oxidation and extending tip life.
Max. and min. temperature:
Limit the temperature range in which the operator is allowed to work.
Instant selection of up to 3 editable temperature settings for solder joints with different heat requirement.
Real time visualization of tip temperature and power delivered to the solder joint during soldering process.
Keep station parameters protected against unauthorized access.
10 user interface languages
English, German, Spanish,
French, Italian, Portuguese,
Russian, Japanese, Korean,
Software PC / Traceability
Soldering Graphics / Profiles
Dino-Lite USB microscope connection. Compatible models: AM2011 and AM2111.
Remote control / Traceability
Interconnection of up to 5 PSE control units
to manage up to 24 tools simultaneously.
Tip to ground resistance
Tip to ground voltage
<2 mV RMS
160 W per tool – 23.5 V
ref. DMSE-1A - 120 V
Ambient operating temp.
10 to 40 ºC / 50 to 104 ºF
See individual modules
368 x 474 x 195 mm / 11.11 kg
14.5 x 18.7 x 7.7 in / 24.49 lb