Hanoi International Exhibition Center - Hanoi, Vietnam.
Booth B14
Shenzhen Convention & Exhibition Center. Shenzhen, China
Hall 1, Booth 1D35
The competition will be held during Electronics Manufacturing Expo (EMAX) Asia 2019 July 17-19, Setia SPICE Arena Penang, Malaysia
The competition will be held during NEPCON Thailand 2019 located at BITEC | Bangkok International Trade and Exhibition Centre, Bangkok, Thailand.
JBC is a Gold Sponsor of the IPC’s Hand Soldering Competition at SMTConnect, which will be held at the Nuremberg Messe.
The competition will be held during the 10th Indonesia International Electronics Components and Technology Exhibition 2019 at the Jakarta International Expo.
JBC is a Gold Sponsor at the inaugural IPC’s Hand Soldering Competition at ElectroSub Technology Conference and Fair, Budapest, Hungary.
The company will be providing live demonstrations of the JBC Net software along with the Dynamic Soldering Profiles functionality.
JBC, a leading manufacturer of soldering and rework equipment, is pleased to announce its participation in the IPC APEX EXPO 2019.
Visitors will be introduced to our new soldering and rework solutions
