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Dynamic Soldering Profiles


How to rework heat sensitive components

The main factors contributing to cracking Multilayer Ceramic Capacitors (MLCC) are the brittleness of the ceramic materials and the thermal and mechanical stresses associated to SMT assembly processes. During manual rework, one of the main risks for these MLCC is the thermal shock that takes place when the soldering tip touches directly the component creating cracks on it.


To mitigate damage to MLCCs, manufacturers have been providing guidelines to reduce the risk of cracking:

 Applying the soldering tip only to the pad so the heat is transferred to lead through the solder alloy.

 Preheating the chip to more than 150°C to reduce the temperature gradient that takes place as soon as the
soldering tip is applied.

Rework components with Dynamic Soldering Profiles

JBC Soldering introduces the final solution for reworking thermal shock sensitive components like MLCC capacitors: Dynamic Soldering Profiles for hand soldering tools.

Now, by combining the new Dynamic Temperature Profile functionality with the most precise JBC rework tools, it is possible to reliably rework MLCC capacitors as small as 008004 and other thermal shock sensitive components individually eliminating the risk of disturbing nearby components.

Rework components with temperature profiles

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