The main factors contributing to cracking Multilayer Ceramic Capacitors (MLCC) are the brittleness of the ceramic materials and the thermal and mechanical stresses associated to SMT assembly processes.
During manual rework, one of the main risks for these MLCC is the thermal shock that takes place when the soldering tip touches directly the component. When this happens, all the heat on the tip is transferred without control to the capacitor creating cracks on it.
In order to mitigate damage to MLCCs, manufacturers have been providing guidelines to reduce the risk of cracking like applying the soldering tip only to the pad so the heat is transferred to lead through the solder alloy, preheating the chip to more than 150°C to reduce the temperature gradient that takes place as soon as the soldering tip is applied, etc.
After three days and with a meaningful growth in attendance, Nepcon South China drew to a close this week. JBC has met the visitor’s expectations by introducing its digital and automated innovations.
Technology companies are continually on the leading-edge, considering unconventional and innovating ways to meet the market demands. JBC has identified this. So we have developed new solutions to achieve greater levels of productivity and efficiency.
You are ready to start a soldering job: PCB and electronic components are clean and free from any contamination; you have a good quality solder flux; the most efficient tip has been chosen… but suddenly realize that oxidation has appeared due to an incorrect maintenance of the tip and the equipment.
What can you do to remove it? Just follow these steps according to the amount of rust!
After three days and with a meaningful upswing in attendance, productronica China drew to a close on the 16th March.
JBC has gained visibility and strengthened its presence at this electronics fair since 2012. productronica China has given the company the chance to find out how the SMT equipment could meet the changing needs of the Chinese manufacturing industry.
Within its growth strategy in the Asian country, the company is also exhibiting for the first time at the next Nepcon South China, which will be held on 29-31 August at the Shenzhen Convention & Exhibition Center.
During the three-day exhibition visitors who approached the JBC stand talked with our soldering experts and experienced our new solutions live. We’ve saved some of the best scenes from our crowded booth to share with you!
IPC APEX EXPO 2017 is a three-day event like no other in the printed circuit board and electronics manufacturing industry. JBC is ready for the show that begins today 14th February at the San Diego Convention Center in San Diego, CA. Stop by booth 715 to experience our new soldering solutions live!
You can also attend our technical sessions on IPC standards and rework applications given by Martin Garcia, an experienced IPC trainer who recently joined the company.